Chinese scientists say they have developed a wafer-scale 2D semiconductor growth method with 1,000 times faster growth, paving the way for industry advances.
The surging demand for high‑performance, low‑power chips driven by AI and large-language models has intensified the search for next‑generation semiconductor technologies.
Moore’s Law predicted a doubling of semiconductor capacity every two years but as chip dimensions continue to shrink, physical limitations make further performance scaling increasingly difficult.
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AI rush turns everyday data storage into ‘digital gold’ for Hong Kong consumers
